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Parameters:

  • Model:BCP56T1
  • Manufacturer:HUABAN
  • Date Code:05+
  • Standard Package:1000
  • Min Order:10
  • Mark/silk print/code/type:BCP56
  • Package:SOT-223

集电极-基极反向击穿电压V(BR)CBO
Collector-Base Voltage(VCBO)
100V
集电极-发射极反向击穿电压V(BR)CEO
Collector-Emitter Voltage(VCEO)
80V
集电极连续输出电流IC
Collector Current(IC)
1A
截止频率fT
Transtion Frequency(fT)
130MHz
直流电流增益hFE
DC Current Gain(hFE)
40~250
管压降VCE(sat)
Collector-Emitter Saturation Voltage
500mV/0.5V
耗散功率Pc
Power Dissipation
1.5W
Description & ApplicationsMEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT Features • Pb−Free Package is Available • High Current: 1.0 Amp • The SOT-223 package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die • Available in 12 mm Tape and Reel Use BCP56T1 to order the 7 inch/1000 unit reel Use BCP56T3 to order the 13 inch/4000 unit reel • PNP Complement is BCP53T1
描述与应用中功率NPN硅高电流晶体管 表面贴装 特点 •高电流:1.0安培 SOT-223封装,可以使用波或回流焊接。所形成的线索在焊接热应力吸收,消除模具损坏的可能性 •可在12毫米编带和卷轴 使用BCP56T1到责令7 inch/1000的单位卷轴 使用BCP56T3责令13 inch/4000单位卷轴 •PNP补语是BCP53T1

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ERIC ELECTRONICS TECHNOLOGY (HK) LIMITED
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BCP56T1
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