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  • Model:BSP19AT1
  • Manufacturer:HUABAN
  • Date Code:05+ 05+
  • Standard Package:1000
  • Min Order:10
  • Mark/silk print/code/type:BSP19
  • Package:SOT-223

集电极-基极反向击穿电压V(BR)CBO
Collector-Base Voltage(VCBO)
400V
集电极-发射极反向击穿电压V(BR)CEO
Collector-Emitter Voltage(VCEO)
350V
集电极连续输出电流IC
Collector Current(IC)
1A
截止频率fT
Transtion Frequency(fT)
70MHz
直流电流增益hFE
DC Current Gain(hFE)
40
管压降VCE(sat)
Collector-Emitter Saturation Voltage
500mV/0.5V
耗散功率Pc
Power Dissipation
800mW/0.8W
Description & ApplicationsNPN Silicon Epitaxial Transistor High Voltage: V(BR)CEO of 250 and 350 Volts. The SOT-223 package can be soldered using wave or reflow. SOT-223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joins. the formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die Available in 12 mm Tape and Reel PNP Complement is BSP16T1
描述与应用NPN硅外延晶体管 高电压V(BR)CEO的250和350伏特。 SOT-223封装,可以使用波或回流焊接。 SOT-223包装保证水平安装,从而提高热传导,并允许目视检查焊接连接。所形成的线索在焊接热应力吸收,消除模具损坏的可能性 可在12毫米编带和卷轴 PNP补BSP16T1

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ERIC ELECTRONICS TECHNOLOGY (HK) LIMITED
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BSP19AT1
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