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Parameters:

  • Model:HSC276
  • Manufacturer:HUABAN
  • Date Code:05+ 05+
  • Standard Package:4000
  • Min Order:10
  • Mark/silk print/code/type:C2
  • Package:SOD-523/UFP/0603

反向电压Vr
Reverse Voltage
3V
平均整流电流Io
AVerage Rectified Current
30mA
最大正向压降VF
Forward Voltage(Vf)
500mV/0.5V
最大耗散功率Pd
Power dissipation
Description & ApplicationsSilicon Schottky Barrier Diode for High Speed Switching • Low reverse current, Low capacitance. • Ultra small Flat Lead Package (UFP) is suitable for surface mount design.
描述与应用•硅肖特基二极管,高速开关 •低反向电流,低电容。 •超小包装(UFP。

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ERIC ELECTRONICS TECHNOLOGY (HK) LIMITED
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HSC276
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