| • Fast Switching Speed
• Low Profile DFN Package (0.575mm typical thickness) is Much
Thinner than Conventional SOT Style Packages
• Thermally Efficient DFN Package Features 500mW Power
Dissipation Capability in a Compact 2.0 * 2.0mm Footprint
• Two “BAV99” Circuits In One Package
• Lead Free/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
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