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  • Model:NDS335N
  • Manufacturer:HUABAN
  • Date Code:05+ 05+
  • Standard Package:3000
  • Min Order:10
  • Mark/silk print/code/type:335
  • Package:SOT-23/SC-59

最大源漏极电压Vds Drain-Source Voltage20V
最大栅源极电压Vgs(±) Gate-Source Voltage20V
最大漏极电流Id Drain Current1.7A
源漏极导通电阻ΩRds DΩ/Ohmain-SouΩ/Ohmce On-State Ω/Ohmesistance0.11Ω/Ohm @1.7A,4.5V
开启电压Vgs(th) Gate-Source Threshold Voltage0.5-1V
耗散功率Pd Power Dissipation500mW/0.5W
Description & ApplicationsN-Channel Logic Level Enhancement Mode Field Effect Transistor General Description These N -Channel logic level enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage applications in notebook computers, portable phones, PCMCIA cards, and other battery powered circuits where fast switching, and low in-line power loss are needed in a very small outline surface mount package. Industry standard outline SOT-23 surface mount package using poprietary SuperSTM-3 design for superior thermal and electrical capabilities. High density cell design for extremely low RDS(ON) Exceptional on-resistance and maximum DC current capability.
描述与应用N沟道逻辑电平增强模式场效应晶体管 概述 这些N沟道逻辑电平增强模式电源领域 场效应晶体管都采用飞兆半导体专有的生产, 高密度,DMOS技术。这非常高密度 过程特别是针对减少通态电阻。 这些器件特别适用于低电压 应用在笔记本电脑,便携式电话,PCMCIA 卡和其它电池供电的电路,开关速度快, 低线的功率损耗,需要在一个非常小外形 表面贴装封装。 行业标准外形SOT-23表面贴装封装 使用poprietary SuperSTM-3设计卓越的热 和电气性能。 高密度电池设计极低的RDS(ON) 卓越的导通电阻和最大DC电流能力

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