Home
Cart0
Inventory:0 Min Order:10
Parameters
Related model

×

Parameters:

  • Model:NDS355N
  • Manufacturer:HUABAN
  • Date Code:05+
  • Standard Package:3000
  • Min Order:10
  • Mark/silk print/code/type:355
  • Package:SOT-23/SC-59

最大源漏极电压Vds Drain-Source Voltage30V
最大栅源极电压Vgs(±) Gate-Source Voltage20V
最大漏极电流Id Drain Current1.6A
源漏极导通电阻ΩRds DΩ/Ohmain-SouΩ/Ohmce On-State Ω/Ohmesistance0.125Ω/Ohm @1.6A,4.5V
开启电压Vgs(th) Gate-Source Threshold Voltage1-2V
耗散功率Pd Power Dissipation500mW/0.5W
Description & ApplicationsN-Channel Logic Level Enhancement Mode Field Effect Transistor General Description These N-Channel logic level enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage applications in notebook computers, portable phones, PCMCIA cards, and other battery powered circuits where fast switching, and low in-line power loss are needed in a very small outline surface mount package. Industry standard outline SOT-23 surface mount package using proprietary SuperSOT TM-3 design for superior thermal and electrical capabilities. High density cell design for extremely low RDS(ON).Exceptional on-resistance and maximum DC current capability. Compact industry standard SOT-23 surface mount
描述与应用N沟道逻辑电平增强模式场效应晶体管 概述 这些N沟道逻辑电平增强模式电源场效应晶体管都采用飞兆半导体 专有的,高密度,DMOS技术。这高密度工艺特别适合于 最大限度地减少通态电阻。这些设备是特别适合于低电压应用在笔记本 电脑,手提电话,PCMCIA卡,和其他电池供电电路中快速切换,低 线的功率损耗,需要在一个非常小外形表面贴装封装。 行业标准外形SOT-23表面贴装封装 使用专有SuperSOT 设计卓越的TM-3 热性能和电气性能。 高密度电池设计极低的RDS(ON) 卓越的导通电阻和最大DC电流能力。 紧凑型工业标准SOT-23表面贴装

×

Online inquiry:

* From:
To:
ERIC ELECTRONICS TECHNOLOGY (HK) LIMITED
Product:
NDS355N
*Title:
Message:
*Code: