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类型 Type | 低通 Low Pass |
技术 Technology | RC |
通道数 Number of Channels | 3 |
中心/截止频率 Center / Cutoff Frequency | 90MHz |
衰减值 Attenuation Value | 30dB@800MHz-6000MHz |
电阻 - 通道 (Ω) Resistance - Channel (Ohms) | |
电流 Current | |
数值 Values | C=30pF |
ESD 保护 ESD Protection | 是 Yes |
Description & Applications | APPLICATIONS Cellular Phones Notebooks Personal Digital Assistant (PDA) Ground Positioning System (GPS) SMART Cards IEC COMPATIBILITY (EN61000-4) 61000-4-4 (EFT): 40A - 5/50ns FEATURES ESD Protection > 25 kilovolts Bidirectional EMI Filtering/TVS Low Pass Filters Low Insertion Loss: -3db Roll-Off @ 90MHz Protects Up to Six(6) Data Lines RoHS Compliant in Lead-Free Versions MECHANICAL CHARACTERISTICS 15 Bump Flip Chip Package Weight 0.73 milligrams (Approximate) Available in Tin-Lead or Lead-Free Plating Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245°C Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C Flammability Rating UL 94V-0 8mm Tape and Reel Per EIA Standard 481 |
描述与应用 | 应用 蜂窝电话 笔记本电脑 个人数字助理(PDA) 地面定位系统(GPS) 智能卡 IEC兼容性(EN61000-4) 61000-4-4(EFT):40A - 5/50ns 特点 ESD保护>25千伏 双向EMI过滤/ TVS低通滤波器 低插入损耗:-3db滚降@90MHz的 保护多达六(6)数据线 符合限制有害物质指令(RoHS)规范要求的无铅版本 机械特性 15凸点倒装芯片封装 重量0.73毫克(大约) 可在锡铅或无铅电镀 回流焊温度: 锡 - 铅 - 锡/铅,85/15:240-245°C 无铅 - 锡/银/铜,96/3.5/0.5:260-270°C 阻燃等级UL94V-0 8mm磁带和卷轴每EIA标准481 |
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